With the highly integrated electronic equipment and the rapid development of new energy industry, heat dissipation has become a key bottleneck restricting technological upgrading. Against this background, BN(CHINA) Technology's hexagonal boron nitride powder (h-BN) stands out with its unique performance, becoming the “all-around solution” in the field of thermal conductivity and heat dissipation!

The excellent performance of hexagonal boron nitride powder (h-BN) makes it occupy a unique position in the field of thermal conductivity and heat dissipation. First of all, its thermal conductivity is as high as 30-50 W/m-K, far exceeding that of traditional alumina and other materials, which can quickly conduct heat from the heat source to the heat dissipation components, significantly reducing the performance loss of equipment due to high temperature. It is also worth mentioning that h-BN has both excellent electrical insulation while high thermal conductivity - resistivity of 10¹⁴~10¹⁸ Ω/cm at room temperature, which effectively avoids the risk of short-circuiting of electronic components, and realizes the double guarantee of safety and performance.

In addition, h-BN's chemical stability and high-temperature resistance are particularly outstanding: it can withstand temperatures of up to 1,200°C in air and up to 2,300°C in inert environments, and is highly resistant to corrosion and oxidation, making it a perfect match for the harsh environments of new-energy vehicle battery packs and the like. Its low density (below 1.2g/cm³) supports lightweight design, while its spherical particle shape makes it easy to fill into composites to optimize the uniformity of the thermal conductivity path. What's more, h-BN has additional features such as lubricity and low dielectric loss, allowing it to flexibly respond to the diverse needs of complex scenarios.

In the field of thermal interface materials (TIMs), h-BN is widely used as thermal paste, gel or spacer between CPUs, GPUs and heat sinks. By filling the micron-sized gaps, the thermal resistance of the interface can be reduced by more than 30%, which can significantly extend the life of electronic devices. In the thermal management of new energy vehicle batteries, h-BN, as the core filler of thermally conductive gel, has entered the supply chain of BYD and other headline companies, which significantly reduces the risk of thermal runaway by equalizing the temperature distribution of the battery pack, and protects the safety of electric vehicles.

For 5G and semiconductor heat dissipation challenges, h-BN is integrated into base station high-frequency chip heat dissipation modules and semiconductor package substrates to solve the problem of heat buildup under high power density to ensure signal stability and device reliability. In the high-temperature industry, h-BN coatings are used in molten metal crucibles, high-temperature bearings and other components, significantly extending the service life of the equipment by virtue of its corrosion resistance and high thermal conductivity.

In the future, the innovative potential of h-BN is even more promising: by compounding with graphene and carbon nanotubes to develop ultra-high thermal conductivity composites, or integrating wave-absorbing and electromagnetic shielding functions, h-BN will open up a whole new track in high-end fields such as AI chips and aerospace!

At present, BN(CHINA) Technology h-BN products are synthesized by advanced continuous calcination equipment, and the annual output has reached 1,000 tons, with stable product performance, strong batch supply capability and outstanding cost advantage. Four specifications are available for you to choose from: PBN700 (purity ≥99.5%), PBN500 (purity >99%), PBN300 (purity >98%), PBN100 (purity >97%), and the four products are available with crystalline particle sizes ranging from 1-5 μm, and powder sizes ranging from D50 4μm-20μm. These four specifications have been successfully applied to boron nitride ceramics, high-temperature coatings, mold release agents, lubricants, thermally conductive fillers, high-temperature insulating materials and other industries.